Optimization of process parameters for adhesive bonded joints and Rehabilitation of structures using adhesive bonding

dc.contributor.guide	Ben, B. Satish and Srinadh, K. V. Sai
dc.coverage.spatial
dc.creator.researcher	Chokka, Syam Kumar
dc.date.accessioned	2023-01-05T11:31:27Z
dc.date.available	2023-01-05T11:31:27Z
dc.date.awarded	2021
dc.date.completed	2021
dc.date.registered
dc.description.abstract	File Attached
dc.description.note
dc.format.accompanyingmaterial	None
dc.format.dimensions
dc.format.extent	xvi, 93 p.
dc.identifier.uri	http://hdl.handle.net/10603/437269
dc.language	English
dc.publisher.institution	Department of Mechanical Engineering
dc.publisher.place	Warangal
dc.publisher.university	National Institute of Technology Warangal
dc.relation
dc.rights	university
dc.source.university	University
dc.subject.keyword	Engineering
dc.subject.keyword	Engineering and Technology
dc.subject.keyword	Engineering Mechanical
dc.title	Optimization of process parameters for adhesive bonded joints and Rehabilitation of structures using adhesive bonding
dc.title.alternative
dc.type.degree	Ph.D.