Certain investigations on the characteristics of pulse plating using silver on printed circuit board

Abstract

The Printed circuit market is expanding at a drastic rate over the past few years Manufacturers are exploring new technologies in the manufacturing of Printed circuit boards Printed circuit board is made up of an epoxy board which is non conductive and the components are mounted on the board coated by copper and creating conductive connections between them The double sided Plated Through Hole PCB plays a vital role in electronics industry Here components are placed on both sides of the PCB In double sided PCB holes are drilled and the metal is deposited inside the holes in order to have conductivity between the top and bottom layers Manufacturers strive for uniform plating thickness The aim of this research work is to perform pulse plating and pulse newlinereverse plating inside the holes of double sided PCB using silver Here silver is used for plating since it enhances tarnish resistance Silver has 7 percentage higher newlineconductivity than copper In order to achieve this aim an optimised condition for plating is newlineidentified with highest current efficiency high hardness and for producing newlineplating with uniform thickness newline newline